EVA LG Chemical EA33045
EVA LG Chemical EA33045
Product Introduction EVA LG Chemical EA33045 is an EVA resin with VA content of 33% and melt index (MI) of 45 g/10min. It is well‑known for outstanding adhesiveness, high transparency, good flowability and processability, favorable compatibility and oxidation resistance. It is mainly applied in hot‑melt adhesive, coating and ink fields.
Main Applications
Hot‑melt Adhesives: Its core application field. Used to manufacture various industrial hot‑melt adhesives, packaging adhesives, wood‑working adhesives for scenarios requiring high bonding strength and stability.
Coating: As coating‑grade material, it can be used for fabric coating, functional coating and paper coating to deliver uniform coating and favorable surface finish.
Ink: Used as ink raw material to provide good adhesion and other related properties.
Foamed Products: Also applied in certain foamed shoe materials and sports goods to offer softness and elasticity.
Others: Applicable to wire & cable, toys and other fields.
Physical Properties
| Performance Category | Test Item | Typical Value | Unit | Test Standard |
|---|---|---|---|---|
| Basic Properties | Vinyl Acetate (VA) Content | 33 | wt% | LG Method |
| Melt Index (190°C/2.16 kg) | 45 | g/10min | ASTM D1238 | |
| Physical Properties | Density (23°C) | 0.958 | g/cm³ | ASTM D1505 |
| Mechanical Properties | Ultimate Tensile Strength | 85 (approx.8.34 MPa) | kgf/cm² (MPa) | ASTM D638 |
| Elongation at Break | 880 | % | ASTM D638 | |
| Shore Hardness A | 62 | ‑ | ‑ | |
| Thermal Properties | Vicat Softening Temperature | <40 | ℃ | ASTM D1525 |
| Melting Temperature | 60‑62 | ℃ | ASTM D3418 |
Processing Technology
| Processing Method | Key Parameter | Recommended Range / Description | Important Reminder |
|---|---|---|---|
| Extrusion Coating | Barrel Temperature Setting | Feeding zone:90‑120°C; Compression zone:130‑150°C; Metering zone:140‑160°C; Die:140‑160°C | Strict temperature control! Maximum processing temperature is generally not recommended to exceed 170‑180°C, otherwise thermal‑oxidative degradation will easily occur, manifested as yellowing, bubble generation and pungent odor. |
| Melt Temperature | ≈140‑160°C | ‑ | |
| Hot‑melt Adhesive Processing | Melting Temperature | Shall be higher than its melting temperature (approx.60‑62°C), subject to formula and equipment. General operating temperature of hot‑melt adhesive reactor:150‑180°C for reference. | Avoid long‑term high‑temperature residence to prevent degradation; keep uniform stirring. |
| Injection Molding | Barrel Temperature | Rear zone:100‑130°C; Middle zone:130‑150°C; Front zone:140‑160°C | Low‑temperature and fast‑processing strategy is required. |
| Mold Temperature | 10‑40°C | Low mold temperature helps shorten cycle time. | |
| Injection Pressure | Medium‑low pressure | High flowability, no excessive pressure required. |
Note: All data above is for reference only.



