PA66 DUPONT 101L NC010 Resin
PA66 DUPONT 101L NC010 Resin
Material Introduction: PA66 DUPONT 101L NC010 (USA DuPont) is a high‑flow, easy‑demolding unreinforced lubricated PA66 resin. Its core advantages include outstanding processing performance (easy filling and demolding), good mechanical strength, wear resistance, oil resistance and electrical insulation property. Its inherent water‑absorption property will affect dimensional stability and partial performances; strict drying is mandatory before processing.
Main Applications
Electronic‑electrical industry: Connectors, coil bobbins, switches, relays and other electrical insulating parts.
Automotive industry: Gears, bearings, rollers, spring brackets, pulleys, high‑pressure sealing gaskets, valve seats, oil pipelines and oil storage containers.
Mechanical parts: Industrial gears, sealing rings, various handles and support frames.
Household appliances: Household appliance components.
Other fields: Ropes, cable ties, transmission belts, etc.
Performance Parameters
| Performance Category | Test Condition / Standard | Unit | Typical Value | Remarks & Interpretation |
|---|---|---|---|---|
| Physical Properties | ||||
| Density | ISO 1183 | g/cm³ | 1.14 | Unreinforced lubricated grade |
| Water Absorption (23℃,24hr) | ISO 62 | % | 1.2(dry) / 8.5(saturated) | ‑ |
| Equilibrium Water Absorption (23℃,50%RH) | ISO 62 | % | 2.6 | ‑ |
| Molding Shrinkage (Flow / Transverse) | ISO 294‑4 | % | 1.4 | ‑ |
| Mechanical Properties | ||||
| Tensile Yield Strength | ISO 527‑2 | MPa | 82.0(dry) / 55.0(conditioned) | ‑ |
| Elongation at Break | ISO 527‑2 | % | 25(dry) / ＞50(conditioned) | ‑ |
| Flexural Modulus | ISO 178 | MPa | 2800(dry) / 1200(conditioned) | ‑ |
| Charpy Notched Impact Strength (23℃) | ISO 179/1eA | kJ/m² | 5.5(dry) / 15(conditioned) | ‑ |
| Rockwell Hardness (R‑scale) | ISO 2039‑2 | ‑ | 121(dry) / 108(conditioned) | ‑ |
| Thermal Properties | ||||
| Melting Point | ISO 11357‑3 | ℃ | 262 | ‑ |
| HDT @1.8 MPa | ISO 75‑2/A | ℃ | 70.0 | ‑ |
| HDT @0.45 MPa | ISO 75‑2/B | ℃ | 200 | ‑ |
| Linear Thermal Expansion Coefficient‑Flow | ISO 11359‑2 | cm/cm/℃ | 1.0E‑4 | ‑ |
| Linear Thermal Expansion Coefficient‑Transverse | ISO 11359‑2 | cm/cm/℃ | 1.1E‑4 | ‑ |
| Electrical Properties | ||||
| Volume Resistivity | IEC 60093 | Ω·cm | 10¹⁴(dry) / 10¹²(conditioned) | ‑ |
| Dielectric Strength | IEC 60243‑1 | kV/mm | 32(dry) / 28(conditioned) | ‑ |
| Relative Permittivity (100 Hz) | IEC 60250 | ‑ | 3.80(dry) / 6.00(conditioned) | ‑ |
| Flammability | ||||
| UL94 Rating (0.71 mm / 1.50 mm) | ‑ | ‑ | V‑2 | ‑ |
| Limiting Oxygen Index (LOI) | ISO 4589‑2 | % | 28 | ‑ |
Injection Molding Parameters
| Processing Item | Recommended Range / Condition | Notes & Explanations |
|---|---|---|
| Drying Treatment | Hot‑air drying above 80 ℃ for at least 4‑6 h; vacuum‑dry at 105 ℃ for over 8 h under high‑humidity conditions. | Critical operation. Control moisture content ≤0.2% to avoid hydrolysis‑induced bubbles, silver streaks and mechanical‑property deterioration. Use immediately after drying or seal and keep warm properly. |
| Melt Temperature | 260‑290 ℃. | Adjust according to equipment and products. Avoid temperature＞300 ℃ or long residence‑time to prevent material degradation. |
| Mold Temperature | 60‑90 ℃ for most parts; 80 ℃ preferred. | Higher mold temperature improves crystallinity, surface gloss and mechanical properties; lower mold temperature shortens cycle time with possible performance impact. |
| Injection Pressure | 60‑100 MPa, adjust per product & mold design. | Low‑viscosity PA66 with good flowability. Higher pressure may be required for complex or thin‑wall articles. |
| Injection Speed | Medium‑high speed. | Fast filling prevents short‑shot caused by rapid cooling. |
| Back Pressure | 0.5‑0.7 MPa (approx.5‑7 kgf/cm²). | Moderate back‑pressure homogenizes melt and facilitates venting; excessive back‑pressure reduces plasticizing efficiency and may cause overheating. |
| Screw Speed | Medium speed. | Avoid excessive shear force to prevent thermal degradation. |
| Runner & Gate | Gate bore ≥0.5 × part wall‑thickness. Smaller gate size for hot runner vs conventional runner. Minimum diameter for submarine gate:0.75 mm. | Short solidification time of PA66, gate location & dimension are critical for filling. |
| Shutdown Notice | Purge barrel with PE / PP of good thermal stability on pause or shutdown to prevent carbonization of residual PA66; turn off heating system for long‑term shutdown. | ‑ |
| Molding Shrinkage | 1.4% (isotropic). | Typical value, subject to process parameters and product design. |
Disclaimer: All above data is for reference only.
