PA9T Kuraray G2330
PA9T Kuraray G2330 Resin
Material Introduction: PA9T Kuraray G2330 is a high‑performance 33% glass‑fiber‑reinforced flame‑retardant PA9T resin. Its core advantages include ultra‑high heat resistance (HDT 285 °C), excellent dimensional stability contributed by ultra‑low water absorption, UL94 V‑0 flame‑retardant rating, as well as favorable mechanical strength and rigidity.
Main Applications
Electronic‑electrical industry: Mainly applied for memory connectors, various electronic product connectors, plugs and sockets. Especially suitable for electronic connectors adopting Surface‑Mount‑Technology (SMT) and lead‑free soldering processes, widely used in computers, digital cameras, mobile phones and other devices.
Automotive industry: Under‑hood automotive parts, transmission components, cooling‑system parts, fasteners, frame‑type automotive components.
Performance Parameters
| Performance Category | Test Condition / Standard | Unit | Typical Value | Remarks & Interpretation |
|---|---|---|---|---|
| Physical Properties | ||||
| Density | ASTM D792 | g/cm³ | 1.62‑1.68 | 33% glass‑fiber reinforced grade |
| Water Absorption (40℃,95%RH,96hrs) | ASTM D570 | % | 0.9‑1.0 | Low‑moisture‑absorption high‑temperature nylon |
| Molding Shrinkage (flow direction) | ASTM D955 | % | 0.10 | ‑ |
| Molding Shrinkage (cross‑flow direction) | ASTM D995 | % | 0.60 | ‑ |
| Melt Flow Rate (MFR) | 320℃/2.16kg, ASTM D1238 | g/10min | 21.0 | ‑ |
| Mechanical Properties | ||||
| Tensile Strength at Break (23℃) | ASTM D638 | MPa | 175‑185 | ‑ |
| Elongation at Break (23℃) | ASTM D638 | % | 2.8‑4.0 | Fiber‑reinforced brittle characteristic |
| Flexural Strength (23℃) | ASTM D790 | MPa | 222‑240 | ‑ |
| Flexural Modulus (23℃) | ASTM D790 | MPa | 11000 | High rigidity |
| Izod Notched Impact Strength (23℃) | ASTM D256 | J/m | 100 | ‑ |
| Rockwell Hardness (R‑scale) | ASTM D785 | ‑ | 125 | ‑ |
| Thermal Properties | ||||
| Heat‑Distortion Temperature (HDT,1.8 MPa) | ASTM D648 | °C | 285 | Outstanding heat‑resistance for SMT reflow soldering |
| Melting Point (Tm) | DSC | °C | 306 | High‑melting‑point polyamide |
| Glass Transition Temperature (Tg) | DSC | °C | 125 | ‑ |
| Electrical Properties | ||||
| Volume Resistivity | ASTM D257 | Ω·cm | 1.0E+16 | Excellent insulation performance |
| Dielectric Strength | ASTM D149 | kV/mm | 30 | ‑ |
| Flammability | ||||
| UL94 Rating (0.75 mm) | ‑ | ‑ | V‑0 | Flame‑retardant reinforced grade |
Injection Molding Parameters
| Processing Item | Recommended Range / Condition | Notes & Explanations |
|---|---|---|
| Drying Treatment | Hot‑air drying:120‑140 ℃ for 4‑6 h (dehumidifying dryer recommended) | Critical operation. Though PA9T features low water absorption, drying is still required after opening bags to prevent performance degradation. Use immediately after drying or seal and keep warm properly. |
| Barrel Temperature | 310‑330 °C | PA9T owns high melting‑point (306 °C), high processing temperature is required. Fine‑tune according to equipment and product structure. |
| Mold Temperature | 130‑150 °C | High mold temperature contributes to good crystallinity, surface gloss and mechanical performance. |
| Injection Pressure | Adjust per product and mold design | Adjust according to actual conditions. |
| Injection Speed | Medium‑high speed | Relatively fast speed benefits filling, suitable for thin‑wall products. |
| Back Pressure | Moderate back‑pressure (medium level is normally acceptable) | Promotes melt homogenization. |
| Screw Speed | Medium screw speed | Avoid excessive shear to prevent over‑heat generation. |
Disclaimer: All above data is for reference only.
