PP Zhenhai Refining & Chemical HP500P Resin
PP Zhenhai Refining & Chemical HP500P Resin
Material Introduction: PP Zhenhai Refining & Chemical HP500P is homopolymer polypropylene specially developed for injection‑molding. Suitable for products requiring good rigidity and dimensional stability. Thanks to favorable rigidity and balanced mechanical properties, it is an ideal option for various injection‑molded articles.
Main Applications
Automotive & home‑appliance modification: automotive components, home‑appliance parts.
Household articles: furniture, partition boards, containers, storage boxes and so on.
Performance Parameters
| Performance Category | Test Item | Test Condition | Value / Range | Unit | Reference Standard | Remarks & Interpretation |
|---|---|---|---|---|---|---|
| Basic Properties | Melt Flow Rate(MFR) | 230℃/2.16kg | To be confirmed | g/10 min | ISO 1133 | Refer to official TDS. |
| Density | ‑ | To be confirmed | g/cm³ | ISO 1183 | Refer to official TDS. | |
| Mechanical Properties | Tensile Yield Strength | ‑ | To be confirmed | MPa | ISO 527 | Refer to official TDS. |
| Flexural Modulus | ‑ | To be confirmed | MPa | ISO 178 | Refer to official TDS. | |
| Notched Impact Strength | 23℃ | To be confirmed | kJ/m² | ISO 179 | Refer to official TDS. | |
| Thermal Properties | Heat‑Distortion Temperature(HDT) | 0.45 MPa, non‑annealed | To be confirmed | ℃ | ISO 75 | Refer to official TDS. |
| Vicat Softening Temperature | ‑ | To be confirmed | ℃ | ISO 306 | Refer to official TDS. |
Injection‑Molding Process Parameters
| Process Item | Suggested Range / Description | Remarks |
|---|---|---|
| Drying treatment | Generally unnecessary; dry at 80℃ for 1‑2 h under poor storage condition | PP low‑moisture‑absorption feature. |
| Barrel rear zone(feed section) | 160‑200℃ | Prevent thermal degradation. |
| Barrel middle zone(compression section) | 180‑220℃ | ‑ |
| Barrel front zone(metering section) | 200‑240℃ | ‑ |
| Nozzle temperature | 200‑240℃ | ‑ |
| Melt temperature | ‑ | 220‑280℃ |
| Mold temperature | 20‑70℃，recommended 40‑60℃ | Crystallization mainly determined by mold temperature. Low temperature: poor surface, weld‑line and flow‑mark risks; high temperature will cause warpage. |
| Injection pressure | 80‑140 MPa(800‑1400 bar) | Higher pressure available for thin‑wall or complex‑structure parts. |
| Holding pressure | 30%‑60% of injection pressure | Prevent sink mark and excessive shrinkage; holding time accounts for approx. 30% of cycle time. |
| Back pressure | 5‑20 MPa(50‑200 bar) | ‑ |
| Injection speed | Medium injection speed; high‑speed injection required for thin‑wall packaging containers. | ‑ |
| Screw speed | High screw speed(linear velocity 1.3 m/s) is permitted | Complete plasticization before cooling phase finishes. |
| Runner & Gate | Pin‑point gate or multi‑point gate; heated hot‑runner, insulated hot‑runner. Gate shall be set at thick‑wall position of product, otherwise severe shrinkage defect easily occurs. | Mold‑design suggestion. |
Disclaimer: All above data is for reference only.
