HDPE Korea Petrochemical F600

HDPE Korea Petrochemical F600 Resin

Material Introduction: HDPE Korea Petrochemical F600 is a high‑density polyethylene grade. Featuring high rigidity, high tensile strength, good tear strength and superior environmental stress‑cracking resistance, it is mainly used for blown‑film products.

Main Applications

Packaging films: general‑purpose packaging bags, industrial‑grade films, shopping bags, benefited from high strength and favorable tear resistance.

Other film products: applied for industrial packaging requiring high toughness and durability, relying on good mechanical performance and environmental stress‑cracking resistance.

Performance Parameters

Performance Category Test Item Test Method / Condition Value & Unit Remarks & Interpretation
Basic Properties Density ASTM D‑792 / D‑1505 0.957 g/cm³ HDPE grade with high hardness and good rigidity.
  Melt Flow Rate (MFR) ASTM D‑1238 (190°C/2.16 kg) 0.035 g/10min Low MFR delivers outstanding melt strength, well‑suited for blown‑film process to maintain product shape.
Mechanical Properties Tensile Strength at Break ASTM D‑638 400 kgf/cm² (≈39.2 MPa) High value indicates excellent tensile‑deformation resistance.
  Elongation at Break ASTM D‑638 <500 % / >500% (different sources) Good toughness and ductility.
  Flexural Modulus ASTM D‑790 10000 kgf/cm² (≈981 MPa) Indicator of rigidity; higher value represents better deformation resistance.
  Rockwell Hardness ASTM D‑785 47 (R scale) Provides certain surface scratch‑resistance.
  Notched Impact Strength ASTM D‑256 <50 kgf·cm/cm (≈>490 J/m) Indicator of impact‑resistance performance.
  Environmental Stress‑Cracking Resistance (ESCR) ASTM D‑1693 (Condition B) >1000 hr Excellent ESCR, critical for liquid‑holding containers and long‑term service articles.
Thermal Properties Melting Point ASTM D‑3418 134 °C Complete melting temperature of resin.
  Heat‑Distortion Temperature ASTM D‑648 (1.8 MPa) 62 °C Heat resistance under load condition.
  Vicat Softening Point ASTM D‑1525 123 °C Alternative heat‑resistance indicator.
  Brittleness Temperature ASTM D‑746 <‑70 °C Retain toughness under ultra‑low temperature with outstanding low‑temperature performance.
Electrical Properties Volume Resistivity ASTM D‑257 1×10¹⁷ ohm·cm Excellent insulating property.
  Dielectric Constant ASTM D‑150 2.3 Electrical insulation parameter.
  Dielectric Strength ASTM D‑149 48 kV/mm Measurement for electrical breakdown resistance.
Other Properties Water Absorption ASTM D‑570 <0.01 % Extremely low water absorption, suitable for humid environment.
  Molding Shrinkage Rate KPIC Method (flow direction) 1.5‑2.5 % Shrinkage range for mold design reference.

Blown‑Film Processing

‑ Processing temperature: general blown‑film temperature range 160‑220℃; fine‑tune according to low‑MFR characteristic and actual equipment. Excessively high temperature causes resin degradation and brittle film; insufficient temperature leads to poor plasticization. ‑ Screw configuration: higher driving power and melt pressure are required for this low‑melt‑flow grade. ‑ Blow‑up ratio: key process parameter, ratio of bubble diameter to die annular diameter. Typical range 2‑4. Higher blow‑up ratio improves transverse strength yet may cause bubble instability and film wrinkles. ‑ Draw ratio: ratio of film take‑up speed to annular extrudate speed. Higher draw ratio enhances longitudinal tensile strength. ‑ Cooling: sufficient cooling is required; well‑performed die cooling system ensures stable film forming.

Disclaimer: All above data is for reference only.

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