PC SABIC (Formerly GE) PC1000R
PC SABIC (Formerly GE) PC1000R
Material Introduction: PC SABIC (Formerly GE) PC1000R is a medium‑viscosity, general‑purpose, unmodified polycarbonate resin. It features favorable mechanical strength, heat resistance, electrical insulation and high transparency.
Main Applications
- Electronic & Electrical Components: Insulating connectors, coil bobbins, tube bases, insulating sleeves, telephone housings and parts, battery housings for miner lamps, etc. Its excellent electrical insulation performance (Class‑E insulating material) and flame retardancy (UL94 V‑2 @1.5 mm) make it suitable for these applications.
- Optical Lighting: Large‑size lamp shades, protective glazing, left‑and‑right objective lens barrels for optical instruments.
- Mechanical Equipment: Gears, racks, worm gears, worm shafts, bearings, cams, bolts, levers, crankshafts, ratchets, as well as protective covers, hoods and frames for mechanical parts.
- Medical Devices: Medical cups, tubes, bottles, dental instruments, drug containers, surgical instruments, and even artificial organs such as artificial kidneys and artificial lungs. (Note: Specific medical applications shall comply with relevant medical regulations and certification requirements.)
- Others: Hollow‑rib double‑wall panels and greenhouse glazing in construction; textile yarn tubes and textile‑machine shaft bushes in textile industry; baby bottles, tableware, toys and models for daily‑use articles.
Physical & Mechanical Properties
| Property Category | Performance Parameter | Test Standard | Value / Range | Unit |
|---|---|---|---|---|
| Physical Properties | Density | ISO 1183 | 1.20 | g/cm³ |
| Melt Mass‑Flow Rate (MFR) | ASTM D1238 (300°C / 1.2 kg) | 10.0 | g/10 min | |
| Melt Volume‑Flow Rate (MVR) | ISO 1133 (300°C / 1.2 kg) | 9.0‑9.5 | cm³/10min | |
| Water Absorption (Saturated, 23°C) | ISO 62 | 0.35 | % | |
| Water Absorption (Equilibrium, 23°C) | ASTM D570 | 0.35 | % | |
| Molding Shrinkage (Flow Direction) | SABIC Method | 0.50‑0.70 | % | |
| Mechanical Properties | Tensile Modulus | ISO 527‑2 | 2350 | MPa |
| Tensile Stress (Yield) | ISO 527‑2 | 63.0 | MPa | |
| Tensile Strain (Yield) | ISO 527‑2 | 6.0 | % | |
| Tensile Strain (Break) | ISO 527‑2 | ＞70 | % | |
| Flexural Modulus | ISO 178 | 2300 | MPa | |
| Flexural Stress | ISO 178 | 90.0 | MPa | |
| Charpy Notched Impact Strength (23°C) | ISO 180/1A | 70 | kJ/m² | |
| Charpy Notched Impact Strength (-30°C) | ISO 180/1A | 12 | kJ/m² | |
| Rockwell Hardness (R‑scale) | ISO 2039‑2 | 120 | ‑ | |
| Thermal Properties | Heat‑Distortion Temperature (1.8 MPa, Unannealed) | ISO 75‑2/Af | 127 | °C |
| Heat‑Distortion Temperature (0.45 MPa, Unannealed) | ISO 75‑2/Bf | 138 | °C | |
| Vicat Softening Temperature (B50) | ISO 306 | 143 | °C | |
| Coefficient of Linear Thermal Expansion (Flow Direction) | ISO 11359‑2 | 7.0E‑5 | cm/cm/°C | |
| Thermal Conductivity | ISO 8302 | 0.20 | W/m/K | |
| Optical Properties | Light Transmittance (2.54 mm) | ASTM D1003 | 88‑90 | % |
| Haze (2.54 mm) | ASTM D1003 | ＜0.8 | % | |
| Refractive Index | ASTM D542 | 1.586 | ‑ | |
| Electrical Properties | Volume Resistivity | IEC 60093 | ＞1.0E+15 | Ω·cm |
| Surface Resistivity | IEC 60093 | ＞1.0E+15 | Ω | |
| Dielectric Strength (1.6 mm) | IEC 60243‑1 | 27 | kV/mm | |
| Relative Dielectric Constant (60 Hz) | IEC 60250 | 3.0 | ‑ | |
| Relative Dielectric Constant (1 MHz) | IEC 60250 | 3.0 | ‑ | |
| Dissipation Factor (60 Hz) | IEC 60250 | 0.001 | ‑ | |
| Dissipation Factor (1 MHz) | IEC 60250 | 0.010 | ‑ |
Injection Molding Processing Parameters
| Processing Stage | Process Parameter | Suggested Value / Range | Unit | Remarks |
|---|---|---|---|---|
| Pre‑drying | Drying Temperature | 120 | °C | Critical requirement |
| Drying Time | 4‑6 | h | Ensure moisture content ≤0.02% | |
| Recommended Dew Point | ＜‑40 °C (dehumidifying dryer recommended) | °C | ‑ | |
| Injection Temperature | Rear Barrel Temperature | 260‑280 | °C | Example value |
| Middle Barrel Temperature | 280‑300 | °C | Example value | |
| Front Barrel Temperature | 290‑310 | °C | Example value | |
| Nozzle Temperature | 280‑300 | °C | Example value | |
| Melt Temperature | 280‑310 | °C | ‑ | |
| Mold Temperature | 80‑100 | °C | Higher mold temperature reduces internal stress and improves surface gloss | |
| Injection Pressure & Speed | Injection Pressure | To be adjusted according to specific product and mold | MPa | Apply maximum feasible injection pressure within allowable range |
| Holding Pressure | 50%‑80% of injection pressure | MPa | Adjust by product structure and dimension to compensate shrinkage and reduce warpage | |
| Injection Speed | Medium | ‑ | Low‑speed injection for small gates; high‑speed injection is acceptable for other gate types | |
| Other Parameters | Screw Speed | Medium (40‑70 recommended) | rpm | Avoid excessive shear and overheating |
| Back Pressure | Moderate (0.3‑0.7 recommended) | MPa | Beneficial for melt homogenization; excessive back pressure will cause temperature rise | |
| Injection Shot Size (% of barrel capacity) | 40‑60 | % | ‑ | |
| Vent Groove Depth | 0.013‑0.020 | mm | ‑ |
Disclaimer: All above data is for reference only.
