PMMA CHIMEI CM‑211

PMMA CHIMEI CM‑211

PMMA CHIMEI CM‑211 is high‑flow polymethyl methacrylate. It delivers excellent optical performance, balanced mechanical properties, good heat‑resistance and weather‑resistance, well‑suited for fast‑fill and complex‑structure injection‑molded articles.

Main Applications

Electrical & electronics: nameplates, speaker panels, instrument housings, electronic outer covers.

Consumer goods: household appliances, stationery.

Decorative parts: complicated‑shape decorative articles difficult for injection molding.

Lighting: lamp covers, diffusion panels.

Automotive: automotive lamp components.

Properties

表格

Property Category Item Test Standard Value Unit
Physical Density ISO 1183 1.19 g/cm³
  Water absorption (24 h) ISO 62 0.3 %
  MVR(230℃/3.8 kg) ISO 1133 53 cm³/10min
  MFR(230℃/3.8 kg) ASTM D1238 8.0‑9.0 g/10min
  Bulk density ASTM D1182 0.77 g/cm³
  Molding shrinkage ASTM D955 0.002‑0.006 mm/mm
  Refractive index ASTM D542 1.491
  Light transmittance (3.2 mm) ASTM D1003 92 %
Mechanical Tensile strength (break) ISO 527‑2 68 MPa
  Elongation at break ISO 527‑2 10 %
  Flexural strength ISO 178 95 MPa
  Flexural modulus ISO 178 2700 MPa
  Charpy notched impact(23℃) ISO 179/1eA 2.00 kJ/m²
  Charpy un‑notched impact(23℃) ISO 179/1eU 23 kJ/m²
  Rockwell hardness‑M ASTM D785 M84
  Ball indentation hardness ISO 2039‑1 148 MPa
Thermal HDT 1.8 MPa(annealed) ISO 75‑2/A 98
  HDT 1.8 MPa(un‑annealed) ISO 75‑2/Af 78
  Vicat B50 ISO 306 96
Electrical Volume resistivity ASTM D257 10¹⁵ Ω·cm
  Dielectric strength ASTM D149 500 V/mil
  Dielectric constant (1 MHz) ASTM D150 3.7
  Dissipation factor (1 MHz) ASTM D150 0.019‑0.05
Flammability UL94 (1.5 mm) UL94 HB class

Injection‑Molding Parameters

表格

Process Item Recommendation Notes
Predrying Drying temperature 70‑75 ℃ / 80‑85 ℃ Desiccant dryer; target moisture<0.1 %
  Drying time 4 h Prevent silver‑streaks & bubbles
Barrel setting Nozzle 190‑220 ℃ Use shallow‑flight screw to avoid frictional degradation / yellowing
  Front zone 190‑210 ℃  
  Middle zone 180‑200 ℃  
  Rear zone 170‑190 ℃  
  Melt temperature 190‑220 ℃ Avoid over‑temperature & long residence time
  Mold temperature 50‑70 ℃ Adjust by wall‑thickness & gating
  Injection speed Medium‑high Take advantage of high flow for thin‑wall filling
  Back pressure 0.5‑1.0 MPa Low back‑pressure for melt homogenization

Note: All data for reference only, follow official TDS for final production.

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