PC/ABS Covestro T45

PC/ABS Covestro T45

PC/ABS Covestro T45 is a plating‑grade alloy material. It combines mechanical strength and heat resistance of polycarbonate (PC) with excellent processing flowability of ABS, and is specially suitable for electroplating treatment.

Main Applications

Electrical‑Electronic: mobile‑phone housings & accessories, smart cards (SIM‑cards); components for notebooks, digital cameras, air conditioners, refrigerators.

Automotive Parts: surrounding parts of instrument panels, air‑conditioning system components, decorative panels.

Office Equipment: panel parts for copiers, printers and fax machines.

Physical Properties

Property Category Test Item Test Standard Data Unit
Physical Properties Density (23°C) ISO 1183 1.10 g/cm³
  MVR (260°C / 5.0 kg) ISO 1133 12.0 cm³/10min
  Molding shrinkage (flow / cross‑flow, 260°C, 3.00 mm) ISO 2577 0.55‑0.75 %
  Water absorption (saturated, 23°C) ISO 62 0.70 %
  Water absorption (equilibrium, 23°C, 50% RH) ISO 62 0.20 %
Mechanical Properties Tensile Modulus (23°C) ISO 527‑2/1 2100 MPa
  Tensile stress (yield, 23°C) ISO 527‑2/50 49.0 MPa
  Tensile stress (break, 23°C) ISO 527‑2/50 40.0 MPa
  Elongation at break (23°C) ISO 527‑2/50 > 50 %
  Izod notched impact strength (23°C) ISO 180/A 40 kJ/m²
  Izod notched impact strength (-30°C) ISO 180/A 36 kJ/m²
Thermal Properties HDT (1.8 MPa, unannealed) ISO 75‑2/A 95.0 °C
  HDT (0.45 MPa, unannealed) ISO 75‑2/B 112 °C
  Vicat softening temperature (B120) ISO 306 112 °C
  Linear thermal expansion coefficient (flow dir., 23‑55°C) ISO 11359‑2 8.5E‑5 cm/cm/°C
Electrical Properties Volume resistivity (23°C) IEC 60093 1.0E+16 Ω·cm
  Dielectric strength (23°C, 1.00 mm) IEC 60243‑1 35 kV/mm
  CTI IEC 60112 275 V
Flame Retardancy UL 94 (0.85 mm) UL 94 HB

Processing Parameters

Process Parameter Unit Recommended Value / Range
Drying Treatment    
Drying temperature °C 95‑110
Drying time h 2‑4
Residual moisture % < 0.04
Injection Molding Temperature    
Rear barrel temperature °C 220‑230
Middle barrel temperature °C 225‑235
Front barrel temperature °C 230‑240
Nozzle temperature °C 240‑265
Melt temperature °C 240‑265
Mold temperature °C 60‑90
Injection Parameters    
Back pressure MPa 5.0‑15.0
Injection speed As high as possible
Suggested shot volume % 30‑70

Note: All information above is for reference only!

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