PC/ABS Covestro Bayblend T45

PC/ABS Covestro Bayblend® T45

PC/ABS Covestro Bayblend® T45 is a plating‑grade alloy material. It combines the advantages of polycarbonate (PC) and acrylonitrile‑butadiene‑styrene copolymer (ABS), and is highly suitable for applications requiring electroplating treatment.

Main Applications

Electrical‑Electronic: mobile‑phone housings & accessories, smart cards (SIM cards), components for notebooks, digital cameras, air conditioners and refrigerators.

Automotive Parts: instrument‑panel surrounding parts, air‑conditioning system components, decorative panels.

Office Equipment: copier panels, printer housing panels, fax machine housing panels.

Physical Properties

Property Category Test Item Test Standard Data Unit
Physical Properties Density (23°C) ISO 1183 1.10 g/cm³
  Melt Volume‑Flow Rate (MVR) (260°C/5.0 kg) ISO 1133 12.0 cm³/10min
  Mold Shrinkage (Flow / Transverse Direction, 260°C, 3.00 mm) ISO 2577 0.55‑0.75 %
  Water Absorption (Saturated, 23°C) ISO 62 0.70 %
  Water Absorption (Equilibrium, 23°C, 50% RH) ISO 62 0.20 %
Mechanical Properties Tensile Modulus (23°C) ISO 527‑2/1 2100 MPa
  Tensile Stress (Yield, 23°C) ISO 527‑2/50 49.0 MPa
  Tensile Stress (Break, 23°C) ISO 527‑2/50 40.0 MPa
  Elongation at Break (23°C) ISO 527‑2/50 > 50 %
  Izod Notched Impact Strength (23°C) ISO 180/A 40 kJ/m²
  Izod Notched Impact Strength (-30°C) ISO 180/A 36 kJ/m²
Thermal Properties Heat‑Distortion Temperature (HDT, 1.8 MPa, unannealed) ISO 75‑2/A 95.0 °C
  Heat‑Distortion Temperature (HDT, 0.45 MPa, unannealed) ISO 75‑2/B 112 °C
  Vicat Softening Temperature (B120) ISO 306 112 °C
  Linear Thermal Expansion Coefficient (Flow Direction, 23‑55°C) ISO 11359‑2 8.5E‑5 cm/cm/°C
Electrical Properties Volume Resistivity (23°C) IEC 60093 1.0E+16 Ω·cm
  Dielectric Strength (23°C, 1.00 mm) IEC 60243‑1 35 kV/mm
  Comparative Tracking Index (CTI) IEC 60112 275 V
Flame Retardancy UL 94 Rating (0.85 mm) UL 94 HB

Processing Parameters

Process Parameter Unit Recommended Value / Range
Drying Treatment    
Drying Temperature °C 90‑110
Drying Time h 2‑4
Recommended Moisture Content % < 0.04
Injection Molding Temperature    
Rear Barrel Temperature °C 220‑230
Middle Barrel Temperature °C 225‑235
Front Barrel Temperature °C 230‑240
Nozzle Temperature °C 240‑265
Melt Temperature °C 240‑265
Mold Temperature °C 60‑90
Injection Parameters    
Injection Speed As high as possible
Back Pressure MPa 5.0‑15.0

Note: All information above is for reference only!

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