PC/ABS CHIMEI(Zhenjiang) PC‑550K
PC/ABS CHIMEI(Zhenjiang) PC‑550K
PC/ABS CHIMEI(Zhenjiang) PC‑550K is a halogen‑free flame‑retardant alloy material with high heat resistance. It combines the easy‑processing property of ABS with high rigidity and high‑impact resistance of PC, and possesses good flowability.
Main Applications
Electrical‑Electronic field: set‑top boxes, projectors, display front bezels, 3C digital products, transformers, game consoles, small tablet computers, network‑communication products, as well as high‑tech products such as computer housings & accessories, mobile‑phone housings & accessories, and automotive component applications.
Physical Properties
| Property Category | Test Item | Test Standard | Data | Unit |
|---|---|---|---|---|
| Physical Properties | Density / Specific Gravity | ASTM D792 | 1.18 | g/cm³ |
| Melt Flow Rate (MFR) | 260°C/5.0 kg, ASTM D1238 300°C/1.2 kg, ASTM D1238 |
18 22 |
g/10 min | |
| Mold Shrinkage | ASTM D955 | 0.4‑0.6 | % | |
| Mechanical Properties | Tensile Strength (Yield) | ASTM D638 | 58.84 | MPa |
| Elongation at Break | ASTM D638 | 80 | % | |
| Flexural Strength | ASTM D790 | 78.45‑78.84 | MPa | |
| Flexural Modulus | ASTM D790 | 2451.66‑2452 | MPa | |
| Izod Notched Impact Strength (23°C) | ASTM D256 | 411.76‑412 | J/m | |
| Rockwell Hardness | ASTM D785 | 118 | — | |
| Thermal Properties | Heat‑Distortion Temperature (HDT, 1.8 MPa, unannealed) | ASTM D648 | 80 | °C |
| Heat‑Distortion Temperature (HDT, 1.8 MPa, unannealed) | ISO 75‑2 | 82 | °C | |
| Heat‑Distortion Temperature (HDT, 0.45 MPa, unannealed) | ISO 75‑2 | 91 | °C | |
| Vicat Softening Temperature | 1kg, 50°C/hr, ASTM D1525 50N, 50°C/hr, ISO 306 |
102‑105 102 |
°C | |
| Flame Retardancy | UL 94 Rating (1.5 mm) | UL 94 | V‑0 | — |
| UL 94 Rating (2.0 mm) | UL 94 | 5VB | — |
Processing Parameters
| Process Parameter | Unit | Recommended Value / Range |
|---|---|---|
| Drying Treatment | ||
| Drying Temperature | °C | 80.0‑90.0 |
| Drying Time | h | 2.0‑4.0 (or ≥4) |
| Recommended Moisture Content | % | < 0.020 |
| Injection Molding Temperature | ||
| Rear Barrel Temperature | °C | 230‑280 |
| Middle Barrel Temperature | °C | 240‑290 |
| Front Barrel Temperature | °C | 250‑300 |
| Nozzle Temperature | °C | 250‑300 |
| Melt Processing Temperature | °C | 250‑300 |
| Mold Temperature | °C | 60‑90 (or ≥60) |
| Mold Parameter | ||
| Vent Groove Depth | mm | 0.030‑0.075 |
Note: All information above is for reference only!
