PC/ABS CHIMEI PC‑385
PC/ABS CHIMEI PC‑385
PC/ABS CHIMEI PC‑385 is an ultra‑high‑heat‑resistance and ultra‑high‑impact alloy resin. It also delivers excellent high rigidity and processing flowability.
Main Applications
Automotive Industry: automotive interior parts.
Electrical‑Electronic: mobile phone housings, electronic product shells, computer housings and accessories.
General Molded Articles: high‑grade safety helmets and other general molded products.
Physical Properties
| Property Category | Test Item | Test Standard | Data | Unit |
|---|---|---|---|---|
| Physical Properties | Density / Specific Gravity | ASTM D792 | 1.14 | g/cm³ |
| Melt Flow Rate (MFR) | 260°C / 3.8 kg, ASTM D1238 | 13 | g/10 min | |
| Mold Shrinkage (Flow Direction) | ASTM D955 | 0.40‑0.60 | % | |
| Water Absorption (23°C, 24 hr) | ASTM D570 | 0.40 | % | |
| Mechanical Properties | Tensile Strength (Yield, 23°C) | ASTM D638 | 53.0 | MPa |
| Elongation at Break (23°C) | ASTM D638 | 90 | % | |
| Flexural Strength (23°C) | ASTM D790 | 78.5 | MPa | |
| Flexural Modulus (23°C) | ASTM D790 | 2300 | MPa | |
| Izod Notched Impact Strength (23°C, 3.18 mm) | ASTM D256 | 640 | J/m | |
| Rockwell Hardness (R‑Scale) | ASTM D785 | 114 | — | |
| Thermal Properties | Heat‑Distortion Temperature (HDT, 1.8 MPa, unannealed) | ASTM D648 | 110 | °C |
| Heat‑Distortion Temperature (HDT, 1.8 MPa, unannealed) | ISO 75‑2/A | 108 | °C | |
| Vicat Softening Temperature | ASTM D1525 | 141 | °C | |
| Vicat Softening Temperature | ISO 306/A50 | 139 | °C | |
| Linear Thermal Expansion Coefficient‑Flow Direction (40‑100°C) | ASTM D696 | 6.0E‑5‑8.0E‑5 | cm/cm/°C | |
| Flame Retardancy | UL 94 Rating (1.50 mm) | UL 94 | HB | — |
| UL 94 Rating (3.00 mm) | UL 94 | HB | — |
Processing Parameters
| Process Parameter | Unit | Recommended Value / Range |
|---|---|---|
| Drying Treatment | ||
| Drying Temperature | °C | 80.0‑100 |
| Drying Time | h | 4.0 |
| Recommended Moisture Content | % | < 0.04 (typical value) |
| Injection Molding Temperature | ||
| Rear Barrel Temperature | °C | 200‑230 |
| Middle Barrel Temperature | °C | 230‑270 |
| Front Barrel Temperature | °C | 220‑260 |
| Nozzle Temperature | °C | 230‑270 |
| Melt Processing Temperature | °C | 220‑270 |
| Mold Temperature | °C | 50.0‑100 |
| Injection Parameters | ||
| Injection Pressure | — | Depends on molded parts |
| Injection Speed | — | As high as possible |
Note: All information above is for reference only!
