PC/ABS CHIMEI PC‑510

PC/ABS CHIMEI PC‑510 is a halogen‑free flame‑retardant alloy material with high flowability. It also features high rigidity and high impact resistance.

Main Applications

Electrical‑Electronic field: set‑top boxes, projectors, 3C digital products, transformers, game consoles, network‑communication products, computer monitor housings, computer and communication components.

Physical Properties

Property Category	Test Item	Test Standard	Data	Unit
Physical Properties	Density / Specific Gravity	ASTM D792	1.16‑1.17	g/cm³
	Melt Flow Rate	260°C / 2.16 kg, ASTM D1238	20‑22	g/10 min
	Mold Shrinkage	ASTM D955	0.40‑0.60	%
	Water Absorption	23°C, 24hr, ASTM D570	0.40	%
Mechanical Properties	Tensile Strength (Yield)	23°C, ASTM D638	49.0‑57.0	MPa
	Elongation at Break	23°C, ASTM D638	110	%
	Flexural Strength	23°C, ASTM D790	78.5‑91.0	MPa
	Flexural Modulus	23°C, ASTM D790	2450‑2600	MPa
	Izod Notched Impact Strength	3.18 mm, ASTM D256	710	J/m
	Rockwell Hardness (R‑Scale)	ASTM D785	113	—
Thermal Properties	Heat‑Distortion Temperature (1.8 MPa, unannealed)	ASTM D648	75‑78	°C
	Vicat Softening Temperature	ASTM D1525	94.0	°C
	Linear Thermal Expansion Coefficient‑Flow Direction	40‑100°C, ASTM D696	6.0E‑5‑8.0E‑5	cm/cm/°C
Flame Retardancy	UL 94 Rating (1.5 mm)	UL 94	V‑0	—
	UL 94 Rating (2.0 mm / 2.1 mm)	UL 94	5VB	—
	UL 94 Rating (3.0 mm)	UL 94	5VA	—

Processing Parameters

Process Parameter	Unit	Recommended Value / Range
Drying Treatment
Drying Temperature	°C	85
Drying Time	h	≥ 4
Recommended Moisture Content	%	< 0.04
Injection Molding Temperature
Rear Barrel Temperature	°C	200‑230
Middle Barrel Temperature	°C	230‑260
Front Barrel Temperature	°C	220‑250
Nozzle Temperature	°C	220‑250
Melt Temperature	°C	245‑285
Mold Temperature	°C	40‑100
Injection Parameters
Injection Pressure	—	Depends on molded parts
Injection Speed	—	As high as possible

Note: All information above is for reference only!