Laser Marking Equipment

Multiple domestic factories for bidding. Free promotion. Price to be negotiated between winning bidder and buyer.

Please provide below information for posting:

Model or functional requirements; 2. Processed material; 3. Power; 4. Marking area; 5. Marking speed; 6. Purchase quantity

表格

Type	Laser Wavelength	Core Advantages	Main Limitations	Typical Application
Fiber Laser Marker	1064 nm	High‑quality laser beam, high electro‑optical efficiency (>30%), long service life (>100 000 hours), maintenance‑free, air‑cooled. Compact size for fine marking.	Poor absorption on some non‑metals (wood, leather); high equipment cost.	Metals (iron, copper, aluminum, alloys), plastics (ABS, PP), electronic components, phone keys, IC chips, jewelry.
CO₂ Laser Marker	10.64 μm	Mature technology, low cost, fast marking speed; excellent absorption for non‑metals such as paper, wood and acrylic.	Cannot process metals; short service life for glass‑tube CO₂ laser; relatively large spot, not fit for high‑precision micro‑processing.	Wood, leather, fabric, acrylic, paper, glass, ceramics, food packaging, craft engraving.
UV Laser Marker	355 nm	"Cold‑processing" feature: high‑photon‑energy directly breaks chemical bonds of materials, minimal heat‑affected zone, smooth & sharp marking edges. Ideal for high‑precision and heat‑sensitive materials.	Expensive equipment, relatively low power, high maintenance cost.	Food & pharmaceutical flexible packaging, plastic keys, LCD panels, wafers, ceramics, medical devices, solar cells.
Green Laser Marker	532 nm	Performance between infrared and UV. Good absorption for high‑reflectivity materials (copper, gold, silver) and partial transparent materials (glass); high marking fineness.	High price, relatively low electro‑optical efficiency, complex equipment structure.	High‑reflective metals (copper alloy, gold, silver), ITO glass, gems, optical lenses, ceramics, high‑temperature PCB boards.

Besides the above mainstream types, there are lamp‑pumped YAG laser markers and semiconductor‑pumped laser markers. The lamp‑pumped YAG is an early‑generation model with large spot and frequent krypton‑lamp replacement, gradually replaced by fiber markers. The semiconductor‑pumped type is a transitional product before fiber markers became popular; more stable than lamp‑pumped YAG yet high‑priced.

Core Specifications: Hard Indicators for Selection

Laser Power (W): Core parameter determining processing capacity and speed. Higher power brings faster marking speed and deeper engraving depth. Common power grades: 10W, 20W, 30W, 50W, 100W, 200W. UV & green lasers usually deliver low power (3W‑15W); CO₂ can exceed 100W; fiber lasers range from 10W to 200W. Selection tips: Fiber laser ≥20W for deep metal engraving and black marking on anodized aluminum; 10W‑20W for ordinary metal & plastic marking; CO₂ laser ≥30W for non‑metal cutting & engraving.

Marking Area / Working Field (mm): Maximum scanning range of laser galvanometer, defines the maximum workpiece dimension for one‑pass processing. Standard sizes: 70×70mm, 110×110mm, 150×150mm, 200×200mm, 300×300mm. Larger field available via configuration or customization. Selection tips: Choose according to maximum workpiece size. Small workpieces adopt small field for higher spot density; large workpieces adopt large field or motorized moving platform.

Laser Wavelength (nm): Fundamental factor governing material absorption. 1064 nm (infrared) for metals & partial plastics; 10.6 μm (far‑infrared) for non‑metals; 532 nm (green) for high‑reflective & transparent materials; 355 nm (UV) for heat‑sensitive materials and ultra‑high‑precision jobs.

Repositioning Accuracy: Key indicator for equipment precision. Galvanometer‑type markers normally achieve ±0.01 mm ~ ±0.003 mm. Selection tips: ±0.01 mm sufficient for general marking; ≤±0.003 mm required for high‑precision work such as PCB cutting and wafer dicing.

Marking Speed (mm/s or characters/s): Critical parameter for production throughput. General models: 3000‑7000 mm/s; high‑end models over 10000 mm/s or hundreds of characters per second. Selection tips: High‑speed model (>8000 mm/s) recommended for high‑volume on‑the‑fly marking.

Cooling Mode: Determines installation and maintenance requirements. Air‑cooling: Simple plug‑and‑play. Suitable for fiber lasers, ≤30W CO₂ lasers and partial UV lasers. Water‑cooling: Superior cooling performance yet requires chiller and larger footprint. For high‑power CO₂ (>60W), high‑power fiber (>50W) and lamp‑pumped YAG lasers.

Beam Quality (M²): Metric for beam focusing capability. The closer M² is to 1, the better beam quality, smaller focused spot and higher energy density. Fiber laser M² typically <1.1, much better than lamp‑pumped YAG (M² ~5‑10).

Selection Guidelines

‑ Determine wavelength by material: Metals → fiber marker; Non‑metals (wood / paper / leather / acrylic) → CO₂ marker; Transparent / high‑reflective / heat‑sensitive / high‑precision → UV or green marker. ‑ Determine power by depth & speed: 10W/20W for surface marking; 30W/50W/100W for deep engraving or ultra‑fast processing. ‑ Determine working field by workpiece dimension: Measure maximum workpiece size, select one‑size‑up standard field or custom large format. ‑ Determine model by precision requirement: UV or high‑precision fiber marker for precision electronics; standard fiber marker for general hardware. ‑ Determine cooling mode by working environment: Air‑cooled for office or clean‑room; water‑cooled with chiller for high‑temperature & dusty workshops.

Participation Process

Manufacturers: Contact supplier service for supply registration.

Buyers: Click group‑purchase or contact procurement service to submit requirements. The platform filters suppliers from database or releases bidding based on aggregated demands. Buyers select competitive suppliers and sign sales contracts.